Thermal Pad T-global Technology – Professional thermal solution, heat solution, heat dissipation, thermal engineering solution expert

One side is non-sticky - Convenient for production line assemble. Ultra soft and good compressibility - Adequately fill the voids of the contact

Thermal Pad 2.2 W/mK, 148X148X1.0mm, TG-A2200 Ultra Soft Gap Filler, Heat Sink Cooling Pad, for PC Laptop/GPU/CPU, Good Insulation

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Products, Thermal interface materials (TIMs)

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TG-A2200 Ultra Soft Thermal Pad T-global Technology – Professional thermal solution, heat solution, heat dissipation, thermal engineering solution expert

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Thermal Pad 2.2 W/mK, 270X135X2.0mm, TG-A2200 Ultra Soft Gap Filler, Heat Sink Cooling Pad, for PC Laptop/GPU/CPU, Good Insulation : Electronics

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