Cylindrical component bonding pad design - The shape of bonding pad is rectangle. When the reflow soldering process is applied, a concave groove must be designed
Bonding surfaces: (a) bonding pads of the ceramic board, (b) bonding
PCB Component Placement
Layout design on bond pads to improve the firmness of bond wire in packaged IC products
Bonding Pad Design Ⅱ
Bonding Pad Design Ⅱ
Bonding Pad
Wire bonding - Wikipedia
Design guide - Mandalon EN
Bonding Pad Design Ⅰ